(467f) Molecular-Dynamics Analysis of the Thermomechanical Behavior of Nanodiamond Superstructures in Interlayer-Bonded Twisted Bilayer Graphene
AIChE Annual Meeting
2020
2020 Virtual AIChE Annual Meeting
Nanoscale Science and Engineering Forum
Carbon Nanomaterials: Synthesis, Functionalization, Assembly, and Applications II
Friday, November 20, 2020 - 9:00am to 9:15am
We report results on the mechanical behavior of such carbon nanocomposite superstructures based on MD simulations of uniaxial straining tests and establish the dependence of the superstructuresâ mechanical properties on the concentration of sp3-bonded C atoms. We also demonstrate that a brittle-to-ductile transition occurs in these superstructures with increasing the concentration of sp3-bonded C atoms beyond a critical level. The underlying ductile fracture mechanism, mediated by void formation, growth, and coalescence, is characterized, and the superior mechanical response to uniaxial straining of the ductile nanodiamond superstructures is demonstrated.
Furthermore, we study the mechanical response of these superstructures to indentation and shear straining based on MD simulations of nanoindentation tests and dynamical shear straining tests. We establish the dependences of the elastic modulus, hardness, and shear strength of the superstructures on the full range of their structural parameters, especially on the fraction of diamond in the nanocomposite superstructure measured by the concentration of sp3-bonded C atoms. The resulting structural responses and fracture mechanisms of the superstructures under nanoindentation testing and shear straining also are characterized in detail. Finally, we report results for the lattice thermal conductivity of these superstructures based on non-equilibrium MD simulations of thermal transport. We find that the lattice thermal conductivity is reduced significantly with increasing concentration of sp3-bonded C atoms in the superstructures, which makes these 2D carbon nanomaterials very promising for thermal management applications.