(495c) Stress Evolution and Cracking in Drying Polymer Films
AIChE Annual Meeting
2020
2020 Virtual AIChE Annual Meeting
Materials Engineering and Sciences Division
Polymer Thin Films, Confinement, and Interfaces I
Wednesday, November 18, 2020 - 8:15am to 8:30am
In the present work, thin films of a polymer solution were cast on substrates of varying stiffness and investigated for cracking as a function of film thickness and substrate modulus. We found that the stiffness of the substrate influence cracking. Decreasing the stiffness of the substrate increases the extent of cracking. Transverse stress was measured during the drying of the film using glass as a cantilever substrate and related to the crack density (Figure 1). The residual stress was found to be independent of dry coating thickness for a low thickness range (⤠20 µm) despite a few cracks that appeared in the film above a critical thickness. Micro-Raman spectroscopy confirms the gradient in polymer concentration (skin formation) across the thickness during drying of films having large thicknesses. The skin formation and extensive cracks followed by delamination from the substrate led to a lower value of residual stress for very large thicknesses films (â¥40 µm). We compare the measurements with predictions of a model that accounts for the elastic energy released due to cracking.