(689g) Fused Filament Fabrication of Hot Melt Adhesives
AIChE Annual Meeting
2020
2020 Virtual AIChE Annual Meeting
Topical Conference: Next-Gen Manufacturing
Polymers in Additive Manufacturing
Thursday, November 19, 2020 - 9:30am to 9:45am
In this work, we demonstrate FFF of a polyamide hot melt adhesive. This adhesive is a semicrystalline polymers with a sub-ambient glass transition temperature, intermediate melting temperatures, and low recrystallization termperature. Due to this combination, this is a room temperature flexible materials that exhibits high toughness and strength, and good adhesion. The effect of extruder temperature on print quality and the effect of raster angle on mechanical properties of prints was studied. The optimized print parameters, as well as low viscosity and high melt strength of the material, resulted in elimination of voids within the prints. Additionally, tensile properties comparable to or better than compression molded hot melt adhesives are observed. This work broadens the material window for FFF and demonstrates that hot melt adhesives can be used to additively manufacture optically transparent, flexible structures capable of >1200% strain to failure.