(164o) Ultra-Stretchable Conductive Polyaniline/Polyelectrolyte/Small Molecule Polymer Complex with Repeatable Autonomous Self-Healing Polymer Electronics | AIChE

(164o) Ultra-Stretchable Conductive Polyaniline/Polyelectrolyte/Small Molecule Polymer Complex with Repeatable Autonomous Self-Healing Polymer Electronics

Authors 

Wujcik, E. - Presenter, The University of Alabama
Duprey, C., Materials Engineering And Nanosensor (MEAN) Laboratory, Department of Chemical and Biological Engineering, The University of Alabama
Lu, Y., The University of Alabama
Jeon, J. W., Kookmin University
Wearable strain sensors are essential for the realization of applications in the broad fields of remote healthcare monitoring, soft robots, immersive gaming, among many others. These flexible sensors should be comfortably adhered to skin and capable of monitoring human motions with high accuracy, as well as exhibiting excellent durability. However, it is challenging to develop electronic materials that possess the properties of skin: compliant, elastic, stretchable, and self-healable. This work demonstrates a new regenerative polymer complex composed of a polyelectrolyte poly(2-acrylamido-2-methyl-1-propanesulfonic acid) (PAAMPSA), conductive polymer polyaniline (PANI) and small molecular dopant phytic acid (PA) as a skin-like electronic material. It exhibits ultrahigh stretchability (1935%), excellent repeatable autonomous self-healing ability (repeating healing efficiency > 98%), and exceptional linearity (R2 > 0.995), outperforming current reported wearable strain sensors. The deprotonated polyelectrolyte, multivalent anion, and doped conductive polymer, under ambient conditions, synergistically construct a regenerative dynamic network of polymer complex crosslinked by hydrogen bonds and electrostatic interactions, which enables ultrahigh stretchability and repeatable self-healing. Sensitive strain-responsive geometric and piezoresistive mechanisms of the material owing to the homogenous and viscoelastic nature provide excellent linear responses to omnidirectional tensile strain and bending deformations. Furthermore, this material is scalable and simple to process in an environmentally-friendly manner, paving the way for the next generation flexible electronics.

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