(140j) Covalent Interfacial Bonding between 2D Materials and Polymer for Flexible Device Fabrication

Two-dimensional (2D) van der Waals materials are excellent candidates for the construction of future flexible devices. They combine the benefits of conventional organic and inorganic electronics materials, in terms of excellent mechanical flexibility, high charge carrier mobility, and compatibility with CMOS technology. On the other hand, their weak interfacial adhesions to polymer substrates usually lead to structural defects, such as peeling, wrinkling, and eventually cause device failure. To overcome this challenge, our team developed an interfacial lamination procedure based on silane functionalization reaction that can deliver reliable, endurance, and robust 2D-material-to-polymer interfacial bonding. Based on that, we investigated the optoelectronic and electronic properties of 2D materials, particularly, the field effect transistor behavior as a function of tensile strain. Our study indicates that the 2D flexible devices fabricated with our method have outstanding electronic performance, providing and feasible pathway for the construction of wearable devices, bio-electronic interfaces, adaptive optoelectronics, and beyond.