There is a high probability that the Hemlock Semiconductor Corporation (HSC) plant located in Hemlock, MI will provide a fair portion if not all of the 99.999% pure polycrystalline silicon or polysilicon needed for the electronics chip manufacturing process at the Intel Corporation facility to be built in New Albany, Ohio. The HSC plant currently is the largest producer of polysilicon in the United States and produces 36,000 tons of polycrystalline silicon annually, ranking it among the top five producers worldwide. The pure form of Si is used in the manufacture of electronic chips as well as solar photovoltaic panels. HSC (founded in 1961) was owned by the Dow Corning Corporation. In June 2016 Dow Chemical Company took full ownership of Dow Corning Corporation and Corning Inc. took 80% of HSC sharing it with 20% ownership by Shin-Etsu Chemical. This ending a 73 year joint venture between Dow Chemical and Corning Inc.
This presentation will step through the polycrystalline silicon five production process areas as it was designed on the Hemlock Semiconductor Corporation (HSC) Pharo III and Pharo IV projects engineered by the Morrison Knudsen Corporation Cleveland offices in 1997 and 1998. The HSC Pharo III and Pharo IV project teams received the Morrison Knudsen Corp. & HSC Award for Engineering Excellence for their work in 1998.
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