Atomic Layer Deposition: More Than Just R&D | AIChE

Atomic Layer Deposition: More Than Just R&D

Thursday, November 16, 2023,
5:00pm to 7:30pm
MST
In-Person / Local
Colorado School of Mines,, Brown Hall, Room 125
1610 Illinois St
Golden, CO 80401
United States

TWO OPTIONS FOR THIS MEETING: ONLINE OR IN-PERSON AT CO SCHOOL OF MINES 

TOPIC:   Atomic Layer Deposition: More Than Just R&D

SPEAKER:  Dr. Matt Weiner

DATE:   Thursday, November 16, 2023

TIME:   5:00 pm - Dinner at Colorado School of Mines

                6:00 pm  - Introduction

                6:05 pm - Career Discussion

                6:15 pm - Technical Presentation

                7:15 pm - Q & A

IN-PERSON LOCATION: Colorado School of Mines, 1500 Illinois St., Golden, CO 80401  After 5pm there are no parking fees and attendees can park in any of the blue, yellow, or purple lots, or in street parking. Recommend parking is the blue D lot, the blue parking garage, or street parking near Brown Hall.  Parking MAP for Brown Hall at CO School of Mines

IN-PERSON MEETING COST:  Free for AIChE members to celebrate our first in-person meeting since Covid.                                               $25 Non members  (pay at door)

SEND EMAIL TO ROCKYAICHE@GMAIL.COM TO REGISTER FOR OUR IN-PERSON MEETING

ONLINE MEETING:  FREE, Zoom presentation begins at 6:00pm, Registration Required       

CLICK HERE TO REGISTER FOR THE ONLINE ATTENDANCE 

ABSTRACT: Many device technologies are progressing towards smaller feature sizes, enabling aggressive form factors, which requires fine control at the atomic scale during materials synthesis. One technique that provides Ångstrom level control over material growth is atomic layer deposition (ALD). Due to the digital growth nature, ALD processes provide a discrete and reproducible amount of film in each cycle, often at sub-Ångstrom thicknesses, conformally coating any feature accessible to the process gas with well adhered thin films. This fine control afforded in ALD allows for unique bulk film structures/compositions such as multilayered or nanolaminate films, where two different films are layered at the nanometer scale. These multilayer films can tune physical properties of the bulk films such as dielectric constant, leakage current, breakdown voltage, gas/moisture barrier performance, and stress, in ways that are otherwise inaccessible with other techniques. In this seminar, I will briefly discuss the basics of ALD, how production tools attempt to overcome the lack of speed and precursor efficiency in ALD, provide some relevant examples of unique properties of nanolaminate films, and end with some examples of how ALD is used in high volume manufacturing today.

SPEAKER BIO: Dr. Matt Weimer is Principal R&D Scientist at Forge Nano who specializes in object and semiconductor applications for atomic layer deposition (ALD). With a background in synthetic organometallic chemistry, experience with novel ALD tool development, and device characterization, he has hands-on experience with the full life cycle of ALD. Matt has a BS in Chemistry from the University of Washington and a PhD in Chemistry from the Illinois Institute of Technology with a joint graduate appointment at Argonne National Laboratory. After a postdoc at Argonne, he joined the R&D deposition group at Lam Research, where Matt spent time on new semiconductor product development. Utilizing his synthetic chemistry background, he developed multiple ALD and CVD solutions, on a variety tool sets, for a range of applications in both logic and memory. At Forge Nano he identifies and develops novel ALD solutions over a range of applications in the semiconductor space and beyond. Matt has multiple papers, patents, and talks in the fields of synthetic chemistry, ALD, and CVD. In his spare time, he is an avid racquetball player, hiker, traveler, and donates his time to the Denver Center for International Studies Foundation and Rocky Mountain Chapter of the America Vacuum Society.