Summary of Presentation:
While electroplating technology has been around for more than 150 years, new customer end use requirements, ever-present downward pressure on process costs and evolution of environmental regulation continue to drive chemistry and process equipment innovation. Examples of new plating technologies designed to help TE Connectivity stay ahead of these challenges will be presented, together with some crystal ball gazing about what kinds of changes may be coming over the next 10 – 20 years.
Schedule:
- 5:30 – 5:45 Meet at TE Connectivity, Middletown, Pa (please arrive by 5:30)
- 5:45 – 6:15 Presentation by Dr. Martin Bayes
- 6:15 – 6:45 Tour of R&D plating line
- 6:45 – 7:00 Q&A, closing remarks and adjourn
- 7:00 – 8:00 Dinner at Angie’s Diner, 1360 Eisenhower Blvd., Harrisburg, Pa 17111 - very close to TE Connectivity (pay your own bill)
Biography of Presenter:
Dr Bayes has spent more than 30 years developing plating products for industrial and electronic plating applications. After completing his Ph.D. at the University of Southampton (UK) in Electrochemistry, he came to the US to carry out post-doctoral research at IBM Yorktown Heights NY, subsequently moving to product formulation positions at plating technology suppliers Enthone Inc (West Haven CT). and Dow Electronic Materials (Marlboro MA). Since 2013, he has worked in the Corporate Technology Materials team at TE Connectivity, with responsibility for new plating and materials development.
Directions:
TE Connectivity, 3101 Fulling Mill Road, Middletown, PA – Volta Conference Room
From Eisenhower Blvd., turn east on Fulling Mill Road. Go under I-283. The TE campus is on both sides of the road; 3101 is the first TE building on the south. Use the entrance on the north side of 3101 and sign the visitor log. Glen Foster will meet you there. Glen’s cell phone is 717-979-6441.
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