(283b) Chip Cooling with Micro-Array Jets

This presentation details the technology elements required to design and manufacture a liquid micro-jet array cooling device, for thermal management of very high power dissipating electronic chips. Multilayer ceramic technology (MLC) is used to build the cooling device with micron size jet arrays, which include distributed return network for the spent fluid. Intertwined microchannel flow networks inside the cooler body distribute the flow in and out of the device. A cooler with 6400 jets and 6561 interstitial returns for the drains built using Glass Ceramic material is discussed. The device when modeled with an 18 mm heated silicon chip and an average convection coefficient of 0.125 MW/m²K demonstrated a cooling capability greater than 6 MW/m². Further extension of the cooling capability as predicted by the simulation is also discussed.