(607e) The Future of Smart Packaging and Rfid: The Path to Widespread Adoption (Panel Discussion) | AIChE

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(607e) The Future of Smart Packaging and Rfid: The Path to Widespread Adoption (Panel Discussion)

Authors 

Rasband, P. - Presenter, Vue Technologies
Lindsay, J. - Presenter, Asia Pulp and Paper, China
Madsen, G. F. - Presenter, Kimberly-Clark Corp.
Subramanian, V. - Presenter, University of California, Berkeley
Fleming, III, P. D. - Presenter, Western Michigan University


In spite of the many brilliant advances in RFID and smart packaging technology, there are challenges in identifying the proper business models to bring these technologies into widespread use. The five participants in this panel will share their insights into the future of these technologies and the pathway to adoption, and will answer questions from the audience.

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