(391a) Copper as An Oxygen Carrier in a Chemical Looping Combustion System: Reaction Kinetics and Fluidized Bed Performance
AIChE Annual Meeting
2010
2010 Annual Meeting
High Temperature Environmentally Sustainable Energy Processes (sessions joint with the Environmental Division)
Chemical Looping Processes II
Wednesday, November 10, 2010 - 8:30am to 8:55am
In order to better classify potential oxygen carriers for a Chemical-Looping Combustion system, a lab-scale bubbling fluidized bed reactor has been designed and built at the University of Utah. In order to simulate a dual-fluidized bed system, the reacting gas is cycled between the oxidizing gas (Air) and the fuel gas (CH4 or H2/CO mixture). Volume percentages of CH4, CO, CO2 and O2 are analyzed in real time by a CAI NDIR/O2 gas analyzer. Copper has been identified as a potential CLOU (chemical looping with oxygen uncoupling) material. A CLOU material has the ability to both bind and release oxygen under different atmospheres without the aid of a reducing agent. This is particularly useful for combustion of solid fuels. In order to overcome the low melting point and associated sintering propensity of pure copper, a titanium oxide support was used. Tests to characterize performance of the supported copper as an oxygen carrier have been conducted at temperatures ranging from 750°C to 950°C. One test was conducted for 24 hours in order to determine the long term performance of copper. Development of internal surface area and particle morphology as a function of the number of looping cycles is presented. Such data is important when considering applicability in industrial systems where attrition resistance and long-term reactivity are important. This paper describes the experimental approach, data analysis and assessment of the potential for copper as a carrier in full-scale systems.