(105e) Lead-Free Nanosolders for Nanowires Assembly and Packaging

The demand for high-performance interconnects in advanced packaging pushes the dramatic scaling down of the electronics packaging feature size from microscale to nanoscale. In the last several years, the approach of nanosoldering has shown promise in the construction of functional and interconnected nanostructures from nano-building blocks by utilizing nanosolder reflow processes. In this research, the potential of nanosolder materials and their applications in nanowires assembly are investigated. Nanosolders have been directly fabricated onto nanowires with different functional segments. By following a reflow process, the reliable nanosolder joints are formed between nanowires. The melting behavior and diffusion of nanosolders between nanowires have been studied for nanocomponent joining and interconnection. The interaction of nanosolders with metallic surfaces of copper nanowires and substrate are studied. The effect of industrially relevant fluxes has been studied on nanosolder reflow processes. These studies provide necessary first-hand knowledge in developing the nanosoldering techniques and their potential applications in nanomaterials assembly and nanodevice fabrication.