(191h) Development and Application of Tin/Indium (Sn/In) Nanoparticles As Low Melting Temperature Nanosolder Materials

Low melting temperature lead-free solder materials are attractive for many electronic assembly and packaging processes. There are several advantages for low temperature applications, for example, applicable for flexible electronics, environmental friendly, and higher energy efficiency. Herein we report the synthesis and development of tin/indium nanosolder particles to serve as a new nanosolder material for low temperature processing and applications. The nanosolder particles are synthesized through a surfactant-assisted chemical reduction method in an aqueous phase. Parameters that affect the size and shape of the nanosolder particles have been investigated. SEM, TEM, XRD and EDS have been used to determine the structure and composition of the nanosolders. DSC measurement has been employed to determine the thermal property of the nanosolder particles. Furthermore, the characterizations of melting behavior and intermetallic formation are provided from the reflow and soldering tests. The results indicate that the tin/indium nanosolder particles have good potential for low temperature soldering applications.