(498b) Advanced Nanomaterials Assembly and Nano-Joining Based On Lead-Free Nanosolders

Due to the requirements for high-performance interconnects in advanced packaging and nanoelectronics manufacturing, the development of nanotechnology has to meet the dramatic scaling down of the electronics packaging size from micron-scale to nanoscale. Both the micro and nano-joining are key enabling technologies in the construction of micro/nanoelectronic devices. In this study, advanced nanosolder materials are synthesized and developed for micro/nanoelectronics assembly and packaging applications. The micro and nano-joining are shown to be approached by utilizing nanosolders based on nanoparticles and nanowires. Both approaches are useful for the construction of different functional assemblies and nanodevices. The interactions between the nanosolders and substrates, including atomic diffusion, melting and wetting behavior, are studied from both the one-dimensional and two-dimensional perspectives. The nano-joining process is also developed to match the compatibility with the regular electronics assembly and packaging techniques.