(118a) Improvement of Thermal Conductivity for POSS Functionalized BN Fillers/Polyphenylene Sulfide Composites

Polyphenylene sulfide (PPS) presents excellent comprehensive properties and has been widely applied in the fields of electron, automobile, aerospace and machinery, etc. However, relatively low thermally conductive coefficient (λ) of pristine PPS matrix has limited its wider application. In our present work, the combining method of aminopropyllsobutyl polyhedral oligomeric silsesquioxane (NH₂-POSS) and silane coupling reagent of γ-aminopropyl triethoxy silane (KH-560) was performed to functionalize the surface of boron nitride (BN) fillers, aiming to fabricate the corresponding f-BN/PPS composites with enhanced thermal conductivities and optimal dielectric properties. Results revealed that the NH₂-POSS molecule had been grafted on the surface of the BN fillers. And the surface functionalization was benifit for improving the thermal conductivities and decreasing dielectric constant of the PPS composites. The obtained f-BN/PPS composite with 60 wt% f-BN fillers is an excellent polymeric composite with high λ, ideal dielectric constant (ε) and outstanding thermal stability, ε of 3.99, λ of 1.122 W/mK (increased by 400% compared to that of pristine PPS matrix), and T_{Heat-resistance index} (T_HRI) of 275^oC, which holds potential for packaging in continuous integration and miniaturization of microelectronic devices.

References:

1. J. Gu, C. Liang, X. Zhao, B. Gan, H. Qiu, Y. Guo, X. Yang, Q. Zhang, D. Wang, Compos. Sci. Technol., 2017, 139, 83-89.

2. J. Gu, X. Yang, Z. Lv, N. Li, C. Liang, Q. Zhang, Int J Heat Mass Tran, 2016, 92: 15-22.

3. J. Gu, Y. Guo, X. Yang, C. Liang, W. Geng, L. Tang, N. Li, Q. Zhang, Compos. Part A, 2017, 95, 267-273.

4. J. Gu, Z. Lv, Y. Wu, Y. Guo, L. Tian, H. Qiu, W. Li, Q. Zhang, Compos. Part A, 2017, 94, 209-216.

5. J. Gu, X. Meng, Y. Tang, L. Yang, Q. Zhuang, J. Kong, Compos. Part A, 2017, 92, 27-32.