(562h) Fabrication and Characterization of Ionomer-Gated MoTe2 Field Effect Transistors | AIChE

(562h) Fabrication and Characterization of Ionomer-Gated MoTe2 Field Effect Transistors

Authors 

Bostian, M. E. - Presenter, University of Pittsburgh
Xu, K., University of Pittsburgh
Ding, H., School of Material Science and Engineering, University of Science and Technology
McKone, J. R., University of Pittsburgh
Beckman, E. J., University of Pittsburgh
Fullerton-Shirey, S., University of Pittsburgh
The semiconductor-to-metal transition in monolayer MoTe2 has been predicted to occur under uniaxial strains as low as 0.3% and has been experimentally demonstrated in few-layer MoTe2 under 0.2% in-plane tensile strain (S. Song et al., NanoLetters, 16, 2016, 188-). Most of the current approaches to straining two-dimensional (2D) crystals require global strain of a flexible substrate or direct deformation of suspended flakes using, e.g., an AFM tip. We propose a new approach to access the strain-induced phase transition in MoTe2 whereby individual MoTe2 devices can be addressed electrically. The proposed method employs an MoTe2 field-effect transistor (FET) with an ion gate, where the polymer electrolyte is a custom single-ion conductor. The anions in this ionomer are covalently bound to the polymer backbone, while the cations are free to respond to the applied field. In our device design, when a positive gate bias is applied, cations drift away from the gate to the surface of the MoTe2 crystal and establish an electrostatic double layer (EDL) at the electrolyte/semiconductor interface, and a depletion layer at the gate/electrolyte interface. The electrostatic imbalance that is created induces strain in the ionomer, which can be transferred to a free-standing MoTe2 channel and thereby induce a semiconducting-to-metallic phase transition. This strain response has been previously studied in the field of ionic polymer metal composites (IPMCs) for applications in biomimetic actuators and artificial muscle, but has not yet been applied to 2D electronics. MoTe2 crystal FETs are fabricated by electron beam lithography (EBL) on MoTe2 flakes exfoliated onto p-doped SiO2/Si; 10 nm Ti/100 nm Au contacts are deposited by e-beam evaporation. MoTe2 FET transfer and output characteristics will be reported with the channel current modulated by an ionomer gate. EDL formation and dissolution is measured by changes in the channel current (IDS) as a function of the ionic gate bias (VG).

This work is supported by the National Science Foundation under Grant #DMR-1607935.

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