(338r) High-Throughput Screening of Multilayer Systems for Improved Interlayer Adhesion of 3D Printed Parts

3D printing allows for the manufacturing of materials with different compositions and complex geometries compared to industrial techniques such as injection molding. Despite the advantages of 3D printing, prints often have defects such as dimensional inconsistencies and poor surface finishes due to poor interlayer adhesion. These defects in printed parts greatly affect the mechanical performance of the material compared to traditional manufacturing techniques such as injection molding. To manufacture more consistent/stronger prints, we need to understand how materials/processing conditions affect interlayer adhesion. Conventional methods for testing interlayer adhesion are often labor-intensive and slow, which can limit the rate at which data can be generated. In this work, a high-throughput screening method was developed to understand the effects of process-properties on the interlayer adhesion of binary systems. Bilayer films were made with varying processing parameters, such as film composition, press temperature, and printing temperature, to investigate their influence on interlayer adhesion. A High-Throughput Mechanical Characterization machine was used to measure the adhesion strength of the films by measuring their tensile puncture strength. Bilayer films that were solution-processed and annealed above/below the material's glass transition temperature had a lower tensile strength for materials below its glass transition. Similarly, the tensile strength of 3D printed films decreased with increasing time delay between layer depositions. High throughput characterization of strength and adhesion enables accelerated design of process parameters for optimized 3D printed structures.