April Student Night

Chemical Mechanical Planarization (CMP):  An Enabling Technology for Integrated Circuit (IC) Device Manufacturing

Abstract:
This presentation will take a brief look at the history of the development of IC device fabrication technology and the role of CMP in enabling the production of today’s leading edge semiconductor devices.  Cabot Microelectronics Corporation (CMC) is the world’s leading supplier of CMP slurries to the semiconductor industry.  CMC’s customer base includes all of the world’s leading manufacturers of advanced logic and memory chips.

Speaker:
Daniel McMullen is a Director of Business Development with Cabot Microelectronics Corporation and the General Manager of its CMPC Surface Finishes business unit.  Mr. McMullen was one of the founding members of the Cabot Microelectronics business when it was established as the Microelectronics Materials Division of Cabot Corporation in 1995.  The division was spun-off in a 2000 IPO as Cabot Microelectronics Corporation (NASDAQ:CCMP).  Mr. McMullen has been active in the semiconductor industry since the early 1990’s.  He received his M.S. in Chemical Engineering from Tufts University, and
his M.B.A. and B.S. in Chemistry from the University of Cincinnati.  Mr. McMullen is certified in Lean Tools Implementation and he is a Six Sigma Black Belt.

Registration: http://www.cvent.com/d/yrq1f4/4W

To present a poster, please fill out this form: https://docs.google.com/forms/d/18-12QZyK1phPvo1KKm7MoCinYagNhmgu_vOXZXtIhuM/viewform