Plasma Processing | AIChE

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Plasma Processing

Chair(s)

Donnelly, V. M., University of Houston

Co-chair(s)

Agarwal, S., Colorado School of Mines

tba

Presentations

12:30 PM
(258a) In Situ Measurement Of The Ion Incidence Angle Dependence Of The Ion-Enhanced Etching Yield In Plasma Reactors
12:50 PM
(258b) Prediction Of Feature Profile Evolution In Shallow Trench Isolation Etching
1:10 PM
(258c) The Effect Of Oxygen Addition In A Chlorine Plasma During Shallow Trench Isolation Etch
1:30 PM
(258d) The Effect Of Polymerizing Chemistry And Ion Flux On Oxide Fencing, Line Edge Roughness, And Micro-Trenching In Nano-Scale Interconnect Structures For 45 Node Reactive Ion Etching Process
1:50 PM
(258e) Reaction Mechanisms In Patterning Hafnium-Based Metal Oxide Thin Films
2:10 PM
(258f) Plasma Activation Of Polymer Surfaces For Enhanced Adhesion
2:30 PM
(258g) Investigation Of Physical Vapor Deposited Ta / W Multilayer Structure As A Copper Diffusion Barrier

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AIChE Explorer Members $225.00
Non-Members $225.00

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